机构名录

您的位置: > 首页 > 机构名录 > University of Cambridge Electrical Engineering Division

University of Cambridge Electrical Engineering Division

发布时间:2018-07-02 访问次数:3328次 分享:


The research at this Division covers all aspects of electrical engineering from the nano-scale to heavy-duty power applications. Professor Sir Mark Welland is the Divisional Head and Professor Andrew Flewitt the Deputy Head.

Photonics is an active and growing area of research with three groups investigating different aspects of photonics, applications, and materials whilst collaborating with each other and a variety of industrial partners.
The Solid State Electronics and Nanoscale Science group conducts research in large area electronic materials and high-power semiconductor devices, carbon nanotubes, and semiconducting nanowires.
The Electrical Power and Energy Conversion group focuses on power electronic devices and integrated circuits, and their uses in various applications. Other major research strands include solar cells and their integration in power systems, integrated design of electrical machines and drives, electromagnetic modelling, radio frequency and microwave power for industrial applications, and electrical power applications of superconductivity.
The Bioelectronics Laboratory is developing better tools for healthcare.
Centre for Advanced Photonics and Electronics (CAPE) is based on a partnership agreement between the University of Cambridge and a number of major industrial companies for the purpose of jointly commissioned research and device development. Global companies China Aerospace BIACD, China Rail Zhuzhou Institute, Disney Research, and Jaguar Land Rover already put their trust in CAPE to convert thought leadership to industry applications through jointly commissioned research in photonics and electronics.
The Cambridge Innovation and Knowledge Centre brings together research activities in molecular and macromolecular materials in the Electrical Engineering Division. It also draws on the expertise of the Judge Business School, the Institute for Manufacturing (IfM), and the Centre for Business Research (CBR) to create innovative knowledge exchange activities spanning business research, training, and specific exploitation.
The mission of the Cambridge Graphene Centre is to investigate the science and technology of graphene, carbon allotropes, layered crystals, and hybrid nanomaterials. The Centre allows our partners to meet and effectively establish joint industrial-academic activities to promote innovative and adventurous research with an emphasis on applications.
The Nanoscience Centre is an 1800m2 research facility completed in January 2003 and located at the north east corner of the University's West Cambridge Site. The Centre provides open access to over 300 researchers from a variety of University Departments to the nanofabrication and characterisation facilities housed in a combination of Clean Rooms and low noise laboratories.
The EPSRC Centre for Innovative Manufacturing in Large-Area Electronics addresses key manufacturing research challenges aimed to meet end-user needs for multifunctional large-area electronic systems that include sensors, power generation and storage, signal processing and logic elements, and output capability through information display or by wireless transmission.




科创项目库

更多>>
  • microscopic AI sensor chip

    项目简介:We have developed a microscopic AI sensor chip (Smart Dust) featuring energy harvesting (this eliminates the use of toxic batteries) and bidirectional non-magnetic (RF-free) wireless communication. Its small size allows it to be easily embedded into ev

  • 半导体功率器件商业IDM项目

    项目简介:以最省預算及人力使中國更快速的赶上世界級领先的功率芯片集成電路廠 • 政府驱动的先进半导体工艺公司 • 5年内在中国建立第一家功率解决方案公司,10年内成为世界前4大 • 先进沟槽式工艺 • 领先市场的产品 • 有效率的成本花费和工艺的驱动 • 在地化的设计能力和工艺能力

  • 先进功率半导体芯片及IPM智能模块

    项目简介:公司成立于2019年,是一家创新创业型公司。公司拥有一流的海外以及国内专家团队,专注先进功率半导体芯片及IPM智能模块,利用团队在新能源汽车电子领域的丰富经验及知识产权,在资本及平台资源的支持下经营先进功率半导体器件+新能源汽车产业链,融合新技术,用研发创新赢得市场赞誉。 公司是以新型大功率高效电力电子器件的芯片设计、制造、销售为主要业务,产品应用广泛:节能灯、LED照明、充电器、各类开关电源、电磁灶、变频电机、电焊机、太阳能逆变器、电动自行车、电动汽车等。

  • 高端模拟集成电路芯片设计项目

    项目简介:主要产品及技术研发有3个方向,一是高速、高精度ADC、DAC核心关键技术、产品及IP研发;其次是用于智能装备领域的线性位移测量系列芯片、高端仪器仪表用芯片、工业物联网芯片;其三是以CT芯片为代表的高端医疗电子芯片。未来,公司拟围绕ADC核心技术,继续布局各种传感器读出电路芯片,应用于航空航天、核工业领域的抗辐照模拟芯片。